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3D packaging using through silicon via (TSV) technology is becoming important in IC packaging industry. The polymer material as insulation material was fabricated by the spin-coating or spray-coating process. And the polymer insulation can relax some of the stress induced and makes the process more convenient compared with CVD. Therefore, it is the most cost effective technology for the wafer level...
Through silicon via (TSV) is an enabling technology for 3D interconnection. The insulation layer at the bottom of the via usually needs to be removed in order to expose the pad so that the electrical interconnection from the front side to the back side can be realized. This removal may be implemented by plasma etching, laser drilling, or photolithography. Compared with the other two methods, photolithography...
Through silicon vias are key components in 2.5D and 3D microelectronic packaging. Deep silicon etching is the critical step in fabrications of TSVs. Uniform metal-assisted chemical etching (MaCE) has been considered as a promising method to the conventional deep reaction ion etching for deep silicon etching. In this paper, we demonstrated that the uniform MaCE method is capable of fabricating vertical...
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