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With regulations mandating industry toward Pb-free solders in all electronics, the development of interconnecting materials capable of withstanding harsh thermal conditions becomes one of the key technological elements for the development of next generation wide band-gap semiconductors. By reflowing Ni/Sn/Ni interconnects under temperature gradient, a new transient liquid phase (TLP) bonding process...
With the continued demand for fine features, enhanced assembly yield, and improved reliability in the microelectronic packaging industry, there is a need to reduce substrate warpage. Factors such as coefficient of thermal expansion mismatch among several materials in the packaging substrate, modulus of different materials, thickness of different layers, orientation of features in each layer, thermal...
Thermal interface materials based on vertically aligned carbon nanotubes were measured systematically by a laser flash technique. An important modification has been made to the sample structure for the laser flash measurement. Influences of carbon nanotube quality, tip entanglement, alignment and packing density on the overall thermal resistance were discussed.
Adhesives used for mechanical bonding and electrical/thermal transport in high performance electronic packages require high adhesion strength and electrical properties at elevated temperatures. Adhesion strengths of electrically/thermally conductive adhesives on Ni, Cu and Sn surfaces at room temperature and elevated temperature (100 °C) were studied. Their high temperature adhesion strengths on those...
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