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This paper presents the thermal analysis of a high-current dc disconnector which will be used in ITER poloidal field converter. The analysis is based on the finite element method, and thermal-electric module in ANSYS Workbench is adopted. An analysis model involving the effect of contact resistance is first built and then a thermal simulation is performed under the nominal working condition. In addition,...
This paper presents a new method for breaking down a low-power power electronics device into its constructed parts used for reliability study of the device. The exceptional feature of this new method is to break down the device into two main parts: function elements and packaging elements. This method can help for a much better prioritizing the failures in the device, and also with having more structured...
Compared with incandescent lamps and fluorescent lamps, nowadays LEDs (Light Emitting Diodes) are power saving, environment-friendly, and have the advantages of long lifetime and flexible color output. Therefore, LEDs are being widely used in many fields. In this paper, three high-power LEDs packaging modules with different packaging structures were selected to do the performance analysis based on...
In this paper, a 3 W high power LED array system with an in-line pin fin heat sink is designed, fabricated, and investigated for thermal transient analysis. Preliminary finite element simulation is conducted by ANSYS, and LED array average junction temperature is about 40.9°C. In the experiment, electrical test method is used to evaluate the heat dissipation effect of the LED array system. Experiment...
Nowadays LEDs (Light Emitting Diodes) are widely used in many fields. As the fourth generation of lighting sources, LEDs have the advantages of long lifetime, power saving and environment-friendly. In this paper, the thermal variation characteristic of some parameters for two high-power LEDs packaging modules, such as forward voltage, luminous flux, CCT and luminous efficiency, were analyzed experimentally...
Due to lead-free pressure, Sn-Ag-Cu solder is regarded as the potential substitute. However, higher melting point and faintish soldering restrict its wide application. Metal or rare earth metal doping can improve its soldering. In this thesis, effects of Zn, Ge metal doping on electrochemical corrosion behavior of lead-free Sn-3.0Ag-0.5Cu (SAC) solder in 3.5wt.% NaCl solution were investigated by...
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