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Production method and properties of lead-free ball-grid array (BGA) balls in comparison to standard BGA balls with the eutectic Sn-Pb composition are presented. Lead-free BGA balls can also be produced by an innovative process that allows the production of solder balls directly from the melt. In contrast to Sn-Pb solder balls, the surface of lead-free balls is not perfectly shiny but appears partly...
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