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As flash technologies face scaling issues at 32nm and beyond, phase change memory (PCM) emerges as the best performing candidate for scaled non-volatile memories of next generation. To fabricate PCM device with high volume and low power consumption, the structure of PCM has evolved from planar structure to confined cells, which pose challenges for chemical mechanical polishing (CMP) of the phase change...
Non-spherical colloidal particles have shown their great potential in the field of chemical mechanical polishing (CMP) due to their high polishing rate. A new method named “cation induced method” has been developed and used to produce non-spherical colloidal silica particles. We have tested this kind of novel shape particles in the application of SiO 2 's CMP. The material removal rate of...
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