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In this paper new results are presented about our advances in the field of substituting the commonly used FR4 (fiberglass+epoxy) for environmentally friendly substrates in Printed Circuit Board (PCB) technology. Avoiding traditional FR4 substrate may help to reduce a significant part of the generated harmful e-waste. The investigations are based on previous results achieved at the department with...
The paper presents a set of experiments investigating the mechanical performance of PCBs manufactured from biodegradable, sustainable polymers, compared to conventional materials. Cellulose Acetate (CA), Polylactic Acid (PLA) and Flame-Retardant Class 4 (FR-4) substrates were compared during the experiments. The methods involved dynamic mechanical analysis (DMA), three-point bending tests and UL 94...
Water drop (WD) test and a contact angle measurement method were used to investigate the electrochemical migration (ECM) behavior on different microelectronic substrates with silver conductor lines in all cases. Environment friendly substrates were also investigated in this study as possible candidates of the conventional ones. ECM is kind of short failure phenomenon, which can lead to series defect...
The paper focuses on biodegradable Printed Circuit Boards (PCB) from the aspect of PCB fabrication technology and soldering. Different biodegradable Cellulose Acetate (CA) PCBs were used during the tests (one sided and two sided), and the possible application of pre-preg was also taken into account to improve pad adhesion on the base material. The surfaces of the boards were evaluated in order to...
Biodegradable plastics are novel materials which can be degraded by organic methods. The aim of the work was to investigate the usability of a cellulose-acetate (CA) and a polylactide (PLA) based material as a printed circuit board (PCB) with conductive layer peel tests. The common types of conductive layer coating processes were proposed: copper foil lamination, copper electroplating and thick film...
The applicability of decomposable biopolymer (polylactide - PLA) as Printed Wiring Board (PWB) substrate was investigated. A novel approach for low temperature reflow soldering was applied. Different types of PLA boards were prepared and each type was qualitatively characterized. The realized circuit was designed for the use of Surface Mounted (SM) components. The low maximum process temperature of...
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