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A 4×4 power amplifier (PA) array with end-fire on chip antennas is presented in this paper. In the PA array module, four-chips are stacked vertically and spaced by the metal holders. In a single chip, four PA blocks with a 1×4 end-fire on-chip antenna are integrated. 0.13-µm SiGe BiCMOS process is used for fabrication with the experimental ƒT and ƒMAX of 210 and 260 GHz, respectively. The 4×4-PA-array...
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