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The morphology and growth kinetics of intermetallic compounds formed during the soldering reactions between Sn-8Zn-3Bi and Cu substrates at various temperatures ranging from 225 to 350 °C were investigated. The results indicated that a planar layer of Cu32.1Zn66.7Sn0.7Bi0.5 (γ phase) along with a great number of scallop-shaped intermetallic compounds Cu19.3Zn77.8Sn2.9 (ɛ phase) appeared at the interfaces...
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