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With continuous shrinking of devices in accordance with Moore's law, metal-semiconductor resistivity starts playing an important role for device performance. To meet ITRS target of 10−9 Ω·cm2 by 2023, it is important to evaluate the effect of different device parameters such as doping concentration, Schottky barrier height, strain and SiGe mole fraction on contact resistivity. In this work, such a...
As logic devices continue to downscale, interconnections are reaching the nanoscale where quantum effects are important. In this work we introduce a semi-empirical method to describe the resistance of copper interconnections of the sizes predicted by ITRS roadmap. The resistance calculated by our method was benchmarked against DFT for single grain boundaries. We describe a computationally efficient...
The thermoelectric power-factor (PF) and efficiency (ZT) of GaAs nanowires (NWs) can be improved by (i) choosing a proper wire growth and channel orientation, (ii) by applying uniaxial tensile stress, and (iii) suitable wire cross-section size. In this work we study the impact of these three factors on the PF and the ZT. Tensile stress, channel direction and cross-section size allows bandstructure...
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