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This paper presents a hybrid silicon etching processing technique for removing the entire bulk silicon to release microstructure. The proposed method that combines a back-side wet anisotropic pre-etching and a front-side XeF2 dry isotropic post-etching differs from previous works in silicon micromachining. Wet anisotropic pre-etching enhances the low-cost of the proposed method while the XeF2 dry...
The interface of Au/Si(100) eutectic bonding was investigated by infrared (IR) microscope and related to the bond strength. A strong relationship between the IR images and the bond strengths was found. Bond strength test showed that a strong bond has many square black spots in the IR images, whereas a poor bond has fewer or no square black spots. In order to study the nature of the relationship, the...
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