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The high temperature damping behavior of (submicron + micron) bimodal size SiCp reinforced Mg matrix composite was investigated in present study. Results revealed that the addition of bimodal size SiCp brought a moderate activation energy of grain boundary peak for Mg matrix as compared with the composite reinforced by single sized submicron/micron SiCp. Even though the volume fraction of micron SiCp...
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