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Polymer-based anisotropic conductive film has become widely used in many electronic packaging interconnect applications. In this study, thermosonic flip chip bonding technology for anisotropic conductive film (ACF) joints in Chip-on-Glass (COG) assemblies is investigated. The effects of ultrasonic bonding process parameters on the degree of cure and bond strength of polymer-based anisotropic conductive...
Under compressive stress, the plastic deformation mechanism of the powder metallurgy (P/M) process metal matrix composite (MMC) varies with the bonding strength of interfaces. The strength of the bonds among the matrix particles, the particle size distribution, and the bonding strength between the matrix particles and the reinforcement dominate the mechanical behaviors of MMC. In this study, simple...
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