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In this work, the textured surface of the multi-crystalline silicon (mc-Si) wafers sliced by the diamond wire sawing (DWS) technique was formed using the X-Y axis micro-pressure sandblast treatment and the acidic texturing process. From the scanning electron microscopy (SEM) images, the X-Y axis micro-pressure sandblast treated DWS-sliced mc-Si wafers could effectively remove the saw marks caused...
The laser-assisted plasma-enhanced chemical vapor deposition (LAPECVD) system was proposed to deposit high performance and high stability Si-based thin-film solar cells. In the LAPECVD system, the CO2 laser and plasma were simultaneously utilized to effectively decompose the SiH4 reaction gas. Consequently, the hydrogen concentration in the i-Si absorption film was reduced with an increase of CO2...
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