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Using the concept of circular economy to develop the electronic information industry in Shaanxi province will promote the electronic information industry to further development, but it is a hard work in practice, for developing circular economy has path dependence. This paper provides a theoretical explanation and establishes a cycle network for developing circular economy.
Summary form only given. We introduce a novel sensor concept in the field of plasmonics, namely plasmon-induced transparency sensors. These sensors combine localized particle plasmon resonances with extremely small sensing volume with excellent sharp spectral resonances that show a good response to refractive index changes of the surrounding environment. The principle is based on the plasmonic analog...
The microbial re-growth of the pipe wall biofilm in water distribution system may endanger the safety of drinking water, so it is necessary to research the biofilm microbe. In order to study the diversity and growth of biofilm bacteria, a model pipe network which dynamic simulated the distribution system was designed. The bacteria of the model biofilm were cultivated by using R2A. The results shows...
There are some defects on measuring equipment surface temperature directly by the use of the infrared thermograph technology to judge the status of the heat equipment, mainly including the great effect of the background temperature on the measured value which is difficult to be eliminated accurately. However, the temperature change rate of the heat equipment can be considered as the criterion of the...
Past literatures on e-learning system and courseware have focused on the system features and on the technologies employed. To integrate IT well with pedagogical principles, it is important to involve instructors in the courseware development. This study seeks to gain insight on courseware development by investigating instructor's different roles in each courseware development phase. Using an educational...
A thermodynamics-based damage mechanics rate dependent constitutive model is used to simulate experiments conducted on thin layer eutectic SnAgCu(SAC) solder joints. The non-damage constitutive is measured by bulk tensile test. The relationship between true stress and strain is sigma=85.26epsiv0.3536. Damage evolution equation is proposed based Lemaitre ductile damage theory and the constant in the...
It is well known, reliability and workability are the more important issues in the field of chip size package (CSP). Creep and fatigue behaviors are the main loads of the solder joints, the reliability of which should take account of those two main loads. Based on the theory of continuum damage mechanics (CDM), this paper focuses on damage evolution of interaction between the fatigue and creep. A...
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