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We present a monolithic CMOS Integrated Nano Photonic transmitter with a link sensitivity comparable to a 25 Gb/s commercial reference transmitter, exhibiting a 5.2 dB extinction ratio, 4.9 dB insertion loss, and error free operation up to 32 Gb/s.
Enabling single-mode photonic packaging in high-throughput microelectronic equipment can dramatically improve cost and scalability. We experimentally demonstrate such solution using 12-fiber interfaces and flipped-chip lasers. We measure −1.3dB peak fiber-to-chip transmission.
We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count.
A sub-100nm technology that allows the monolithic integration of optical devices as features into a 90nm base high-performance logic technology node is demonstrated. The technology is promising for next generation optical communications for applications.
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