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In this paper, a 60 GHz CMOS on-chip dipole antenna with helium-3 ion irradiated silicon substrate is designed using knowledge of electromagnetic simulation modeling. Rectangular region with 500 um × 1000 um around the dipole is irradiated by helium-3 ion and conductivity is reduced to 0.01 S/m (1 k Ohm cm). The width of dipole section is wide for broad bandwidth and reduction of conductor loss. There...
Evaluation method of effective permittivity and permeability for dummy metal fills in a CMOS chip is proposed. For each component of anisotropic material property, capacitor and inductor models are considered for a unit-cell of dummy metal fills. The input impedance is obtained by electromagnetic analysis. Effective permittivity and permeability can be evaluated from the input impedance.
This paper describes the electromagnetic (EM) field analysis of a 60 GHz on-chip loop antenna integrated in a 0.18 µm CMOS Technology. The simulation was compared with the measurement. The reflection coefficient showed good agreement between simulation and measurement by assuming a conductive layer of about 1 µm in the simulation. The radiation efficiency is calculated and it was found that the radiation...
Millimeter-wave CMOS RF circuits have been received substantial attention, motivated by the advance of CMOS process [1]. In the millimetre-wave band, the connection, such as wire bonding or flip chip bonding, between the RF circuit and off-chip antenna is not easy task because of the radiation loss and/or adding parasitic components. To overcome the problem, on-chip antennas, which do not suffer from...
This paper proposes a cost-effective antenna-package suitable for the mobile terminal of the wireless file-transfer system. The antenna-package has the end-fire radiation from the open-end post-wall waveguide built in the side of the package. The antenna-package with a 60-GHz CMOS chip is mounted on the edge of a printed-circuit board by BGA technique. The antenna only was fabricated. The antenna...
This paper proposes a dipole antenna integrated on a thick resin layer on the opposite side of a RF circuit layer though a hole in a silicon CMOS chip at 60 GHz. The thick resin layer can enhance the radiation efficiency. The connection loss between the antenna and the RF circuit is expected to be small. The simulated gain of a dipole on a resin layer of 200 μm thickness over a 5 mm square silicon...
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