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Three dimensional integrated circuits present an intriguing challenge for both circuit and system engineers due to their diverse cooling efficiency among the stacked dies. Several recent proposals advocate multiple techniques for thermal management of 3D ICs at different levels of the design, while operating within the confines of thermal heterogeneity. In this paper, we analyze for the first time,...
Convex optimization problems are very popular in the VLSI design society due to their guaranteed convergence to a global optimal point. While optimizing tabular data, significant fitting efforts are required to fit the data into convex form. Fitting the tables into analytically convex forms like posynomials, suffers from excessive fitting errors, as the fitting problem may be non-convex. In recent...
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