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We present a robust method for measuring the cure shrinkage of dispensable organic films in-situ. Samples consist of dispensed organic material (e.g. die attach or underfill) sandwiched between a glass substrate and a silicon die. A Thermal Mechanical Analyzer (TMA) was used to accurately measure the displacement of the die during cure, and to control the temperature. An analytical model has been...
A methodology is presented that allows quantitative prediction of the impact of WLCSP induced mechanical stress on high precision mixed-signal ICs. The simulation flow was tuned using high-resolution experimental variability data measured on dedicated test chips. The methodology is exemplified with an on-chip oscillator circuit suffering from WLCSP stress induced variability.
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