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Chip scale package (CSP) as an advanced technology has been applied to LED lighting devices, besides electromigration (EM) in CSP under high current density has become a critical reliability issue for the future high density microelectronic packaging. In this paper, the thermal-electric-mechanical coupled analysis is performed by the flip-chip CSP LED multi-physical finite element model. Based on...
As the demand of power converter for higher power density is increasing, bonding wire failure of IGBT module becomes more severe. Accordingly, it is of great significance to investigate the reliability of bonding wire under operating condition for improving the reliability of IGBT module. In this paper, the finite element model of IGBT module was established, and a two-step indirect coupling electro-thermal-mechanical...
Current densities of 1.5ASD and additive concentrations of 15ml/L were used to electroplate the copper into TSV to fabricate the test samples. The samples were annealed at 425°C for 30 minutes in a vacuum furnace with the heating rate of 10°C /min. The annealed samples were thermal cycled with temperature range (25∼325°C), heating & cooling rate (10 °C/min), dwell time of 2 min at the peak and...
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