The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Three-dimensional (3D) integration technology using through silicon via (TSV) is an emerging technology for integrated circuit designs. Random access memory (RAM) is one good candidate for using the 3D integration technology. Introducing redundancies into a large-capacity RAM in design phase is essential for yield improvement. In this paper, we present yield-enhancement techniques for 3D RAMs. In...
Built-in self-repair (BISR) techniques are widely used to enhance the yield of memories in a system-on-chip (SOC). A SOC typically consists of hundreds of memories. Cost-efficient BISR schemes for repairing those memories thus are imperative. In this paper, we propose a memory BISR automatic generation (MBAG) framework for designing memory BISR circuits in a SOC. The MBAG framework consists of a test...
Built-in self-repair (BISR) techniques have been widely used for enhancing the yield of embedded memories. This paper presents an efficient BISR scheme for multiport RAMs (MPRAMs). The BISR scheme has a defect-location module (DLM) executing a defect-location algorithm to locate inter-port defects. This enhances the fault-location capability of the applied test algorithm with only a few amount of...
With the nanometer-scale semiconductor technology, built-in self-repair (BISR) schemes are emerging techniques for improving the yield of embedded memories. A built-in self-repairable memory system typically consists of repairable memory cores, wrappers, built-in self-test (BIST) circuit, fuse group, and built-in redundancy-analyzer. This paper presents a system-level verification methodology for...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.