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We propose that the Li anode can be protected by a Cu coating via the technique of magnetron sputtering. Cu has high electrical conductivity, mechanical strength, and chemical stability. Li deposition on Cu coating with a porous structure disperses the local current density and produces a uniform Li-ion flux, greatly suppressing growth of Li dendrites and the layer prevents Li from directly contacting...
The DNA damage and subcellular of copper (Cu) in 8-day-exposure winter wheat (Triticum aestivum L.) were studied to determine Cu genotoxicity mechanisms and compartmentalization. The results showed Cu induced DNA damage significantly in all treated plants, roots are more cytotoxic and genotoxic than shoots. The translocation factors (ratio of Cu concentrations in shoots to those in roots) were from...
We present a finite-element-based analysis to determine if there are potential reliability concerns due to thermally induced stresses in interwafer copper via structures in three-dimensional (3-D) ICs when benzocyclobutene (BCB) is used as the dielectric adhesive to bond wafers. We first partially validate our approach by comparing computed results against two types of experimental data from planar...
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