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In this study, we are pursuing an ultra low-loss interconnect pathway for 3D chip-chip connectivity, incorporating air-clad planar interconnects, air-clad TSVs, and gradual vertical-horizontal transitions. The motivation is to create an air-gap technology that offers the lowest possible effective k-value and near zero loss tangent minimizing the dielectric loss. The design and modeling of air-gap...
In this paper we present the design and fabrication of air-clad planar transmission lines and TSVs that can be used as horizontal and vertical chip-chip interconnects. Performance improvement by using heterogeneous air-clad dielectric is presented for these two types of interconnect structures that establishes the basic motivation for fabricating these structures. The design data is verified by performing...
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