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This paper discusses 120nm AlSb/InAs HEMTs operating at ultra low drain. HEMT is fabricated with ohmic contact evaporation and Schottky T-gates realization. A deep mesa isolation is used to remove completely the buffer leading to air-bridge gate.
We report a comparison between Ti/Al and Ti/Al/Ni/Au ohmic contacts in terms of contact resistivity, thermal stability, depth profile, and surface morphology. The metals were deposited by conventional electron-beam evaporation, and then annealed at 900°C for 30 s in a N2 atmosphere. The lowest value for the specific contact resistivity was obtained using Ti/Al/Ni/Au metallization. Ti/Al/Ni/Au contacts...
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