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Electronic assembly technology is in the transition from traditional tin-lead to lead-free. In comparison with Sn-Pb solders, high melting point and poor wettability of the lead-free solders lead to great challenge in many aspects. It has been accepted that inert N2 atmosphere can improve the wettability and reliablity of solder joints. The focus of this study is to investigate the reliability of...
Electronic assembly technology is in the transition from traditional tin-lead to lead-free. In comparison with Sn-Pb solders, high melting point and poor wettability of the lead-free solders lead to great challenge in many aspects. It has been accepted that inert N2 atmosphere can improve the wettability and reliablity of solder joints. The focus of this study is to investigate the reliability of...
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