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We report the use of highly ordered, dense, and regular arrays of in-plane silicon nanowires as building blocks to produce highly sensitive and well-reproducible surface-enhanced Raman scattering (SERS). A combination of Au nanospheres (AuNPs) and Au coated silicon nanowires (AuSiNWs) was found to exhibit one order higher enhancement of SERS signal compared with that of the normal AuSiNWs substrate...
In this work, reliable electric interconnection for MEMS/NEMS devices was realized by Au/a-Si (amorphous Si) and Au/c-Si (single-crystal Si) eutectic reaction in anodic wafer bonding process. We measured different resistances of di fferent bonding areas under different bonding temperature. When bonding temperature is under 370 °C, the resistance of the different areas (from 200 µm2 to 1000 µm2) fluctuate...
This paper presents a new method for achieving Au/aSi (amorphous Si) eutectic wafer-level bonding. The Si-Glass wafer bonding was conducted with Au layer patterned on glass wafer and amorphous Si layer on silicon wafer. The amorphous Si here was transformed from the single crystal silicon by the Argon implantation process. A novel torsional strength test structure was proposed and applied for characterization...
In this work, both phosphorus doped and undoped Au/Si contact structures were investigated by scanning electron microscope (SEM) and Rutherford backscattering spectrometry (RBS) analysis after annealing at 350 °C for 30 min. The effect of phosphorus doping on the performance of Au/Si inter-diffusion is discussed in this paper. The SEM image of the undoped Au/Si contact structure revealed that inverted...
A novel angular interrogation SPR waveguide sensor based on SOI material is theoretically investigated. The parameters of the sensor such as the thickness of Au and Ti film are optimized.
Thermosonic ball bonding is a popular joining technique in microelectronic interconnect. In this paper, the effects of bonding parameters on the bond strength are investigated mainly using the finite element method. The complete ball bonding process including both the impact and ultrasonic vibration stages is modeled, and the strain rate sensitivity of the gold ball and pad is considered. Five variables...
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