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Solder wetting and dewetting have attracted much more attention in the past years because solder joint is widely used in modern microelectronic technology. In this study, by using a photolithography process, the Au/Cu bilayered film was prepared into a wheel pattern. Wetting experiments of liquid solder on the wheel pattern were carried out on a home-made hot-stage optical microscope in a flow of...
The Au/Cu film was prepared by vacuum evaporation plating method and patterned by the standard lithography process. The eutectic SnPb solder ball was reflowed on the designed film pattern with H2 protection. The liquid solder would flow along the Au/Cu zones and the final wetting shape reflected the original structure of the pattern. The liquid film was extended ahead of the main liquid front and...
The SnPb solder ball was reflowed on the Cu film in a flow of reducing gas, and the reactive spreading process was in situ recorded by a CCD camera. On the thicker Cu films, it was observed that dewetting did not happen even if the Cu6Sn5 intermetallic compounds spalled into the liquid solder. However, on the thinner Cu films, dewetting would occur when the liquid SnPb solder consumed the underneath...
The sputter-deposited Cu thin film, coated with a thinner gold layer, was prepared into the butterfly pattern with alternating zones beween Cu thin film and Si. The eutectic SnPb solder balls with different sizes were reflowed on the butterfly pattern. As a result, the liquid solder would be selectively retained on the Au/Cu film zones. At the same time, under the energy minimization control, the...
The SnPb solder ball was reflowed on the Cu film in a flow of reducing gas, and the reactive spreading process was in situ recorded by a CCD camera. On the thicker Cu films, it was observed that dewetting did not happen even if the Cu6Sn5 intermetallic compounds spalled into the liquid solder. However, on the thinner Cu films, dewetting would occur when the liquid SnPb solder consumed the underneath...
The sputter-deposited Cu thin film, coated with a thinner gold layer, was prepared into the butterfly pattern with alternating zones beween Cu thin film and Si. The eutectic SnPb solder balls with different sizes were reflowed on the butterfly pattern. As a result, the liquid solder would be selectively retained on the Au/Cu film zones. At the same time, under the energy minimization control, the...
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