Search results for: Heegon Kim
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 1 > 138 - 152
2015 International 3D Systems Integration Conference (3DIC) > TS8.29.1 - TS8.29.4
IEEE Microwave and Wireless Components Letters > 2014 > 24 > 11 > 814 - 816