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This paper presents high-$Q$ factor 3-D stacked MEMS inductors on polyimide substrate for wireless power transmission systems. The 3-D double layer stacked structure was designed, fabricated, and characterized, and self-planarization of polyimide was realized. The 3-D inductor achieves an inductance of 7.189 $\mu{\rm H}$ with a high-$Q$ factor of 26.1 at 4.3 MHz. An inductively coupled wireless...
In this paper, flexible MEMS inductors based on Parylene-FeNi Compound Substrate (PFCS) were designed, fabricated and analyzed. We choose parylene as substrate to achieve flexibility and good bio-compatibility. Then, a Ni80Fe20 magnetic film was deposited on the parylene film to form a compound substrate. Moreover, a Ni80Fe20 core was also deposited in the center of the spiral inductor to improve...
This paper presents a new high quality factor (Q) and large inductance (L) stacked polyimide-based spiral inductor. Polyimide (PI) is used as the substrate and the insulation layer to provide good biocompatibility. To achieve multilayers, self-planarization of PI on the surface with 10µm steps was realized. Meanwhile, Ni80Fe20 was successfully electroplated to enhance the performance of inductors...
This paper presents a new high quality factor parylene-based stacked 3D spiral inductor with Ni80Fe20 core for wireless power transmission system. To achieve multilayers, planarization of parylene by oxygen plasma etching was realized. Ni80Fe20 was added as the magnetic core to enhance the performance. The maximum quality factor of the designed circular double-layer inductor reached 99.3 at 60MHz,...
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