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The plasma activation is a promised process to improve the bonding performance for materials pretreated with the plasma. In this study, the chips studded with gold bumps flipped-bonding onto alumina substrates using the thermal compressional bonding. To improve the bonding performance of gold bumps onto copper electrodes, both gold bumps and alumina substrates were pretreated to Ar/H2 plasma at 400...
Cryptographic systems are vulnerable to random errors and injected faults. Soft errors can inadvertently happen in critical cryptographic modules and attackers can inject faults into systems to retrieve the embedded secret. Different schemes have been developed to improve the security and reliability of cryptographic systems. As the new SHA-3 standard, Keccak algorithm will be widely used in various...
One of the most critical reliability problems that the LED COBs are facing is the failure of wire bonding connections. The LED COBs would easily break down due to the mechanical shocks or material stress on the gold wire in conventional package roadmaps. Flip chip technologies are excellent options for solving this problem. This paper has been focused on the challenges during the design and manufacturing...
This study assesses the reliability of the high-temperature storage (HTS) test and high humidity/high temperature (HH/HT) test for an assembly of chips thermosonically bonded onto flex substrates. Environmental parameters used in the HTS and HH/HT tests were consistent with joint electron device engineering council (JEDEC) specifications. The die-shear test was applied to examine changes in die-shear...
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