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Detailed thermal dynamics of high-power IGBT modules are important information for the reliability analysis and thermal design of power electronic systems. However, the existing thermal models have their limits to correctly predict these complicated thermal behavior in the IGBTs: The typically used thermal model based on one-dimensional RC lumps have limits to provide temperature distributions inside...
The dynamical behavior of temperature is becoming a critical design consideration for the power electronics, because they are referred as “thermal cycling” which is the root cause of fatigues in the power electronics devices, and thus is closely related to the reliability of the converter. It is well understood that the loading of power devices are disturbed by many factors of the converter system...
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