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Integrated Flow-Cell Arrays (FCAs) represent a combination of integrated liquid cooling and on-chip power generation, converting chemical energy of the flowing electrolyte solutions to electrical energy. The FCA technology provides a promising way to address both heat removal and power delivery issues in 3D Multiprocessor Systems-on-Chips (MPSoCs). In this paper we motivate the benefits of FCA in...
This article explores the benefits and the challenges of 3D design and discusses novel techniques to integrate predictive cooling control with chip-level thermal-management methods such as job scheduling and voltage frequency scaling. Using 3D liquid-cooled systems with intelligent runtime management provides an energy-efficient solution for designing single-chip many-core architectures.
Rising chip temperatures and aggravated thermal reliability issues have characterized the emergence of 3D multiprocessor system-on-chips (3D-MPSoCs), necessitating the development of advanced cooling technologies. Microchannel based inter-tier liquid cooling of ICs has been envisaged as the most promising solution to this problem. A system-level thermal-aware design of electronic systems becomes imperative...
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