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Advances in interconnect technologies, such as the increase of the number of metal layers and 3-D stacking technique, have paved the way for higher functionality and superior performance while reducing size, power, and cost in modern integrated circuit and packages. However, whether or not the package preserves signal integrity has become a crucial concern for system designers. In this study, a scalable...
We present a multi-region, multi-solver domain decomposition method (MS-DDM) to accurately analyzing the signal integrity problems in integrated circuits with complex geometries. Specifically, we discuss in detail a 3-D full-wave method to model the conductor loss due to finite conductivities in metals. The proposed MS-DDM follows a hierarchical domain partitioning strategy and the original problem...
A frequency-domain multi-solver domain decomposition method is presented to accurately analyze signal integrity problems in multi-scale integrated circuits. In particular, we propose a novel formulation to rigorously account for the conductor loss due to finite conductivities in metals. The proposed non-conformal domain decomposition method follows a hierarchical domain partitioning strategy of the...
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