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FinFETs are being considered as an attractive alternative to enable further CMOS Scaling. In this paper, a device scaling model for the electrostatics of bulk FinFETs is presented. Device parameters such as subthreshold slope (SS), threshold voltage (Vth), off-state current (IOFF)> drain-induced-barrier lowering (DIBL) are modeled showing good agreement with TCAD and experimental results. Besides...
We report the first demonstration of a super-steep subthreshold slope (SS) (the smallest ever reported experimentally) with ultra-thin BOX (UTBOX) FDSOI standard CMOS transistors. Record steep SS of 72μV/dec for Lg=25nm and 58μV/dec for Lg=55nm at room temperature are achieved with low voltages. The device also exhibits high ON-state current (~100μA/μm), as compared to other devices from this class...
The multi-gate architecture is considered as a key enabler for further CMOS scaling. FinFETs can readily be manufactured on SOI or bulk substrates. We report for the first time an extensive benchmark of their critical electrical figures of merit. Both alternatives show better scalability than PLANAR CMOS and exhibit similar intrinsic device performance. Introducing SOI substrates and low doped fins...
The multi-gate architecture is considered as a key enabler for further CMOS scaling. FinFETs can readily be manufactured on SOI or bulk substrates. We report for the first time an extensive benchmark of their critical electrical figures of merit. Both alternatives show better scalability than PLANAR CMOS and exhibit similar intrinsic device performance. Introducing SOI substrates and low doped fins...
Despite their excellent control of short channel effects, FinFETs suffer from different trade-offs in the mixed-signal domain, with respect to planar devices. For the first time, we report a complete and comprehensive comparative analysis showing that these trade-offs can be alleviated in advanced FinFET technology. As such, higher voltage gain and transconductance than planar MOSFETs are reached...
In this paper, the suitability of the MUGFET technology as an alternative device architecture for 32 nm CMOS generation is discussed. In particular, the requirements for the MUGFET devices with focus on FIN geometry, gate stack, and junctions are analyzed. Technological challenges related to the processing of MUGFET devices such as, FIN and gate patterning, junctions and spacer formation, are also...
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