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Thermal management is one of the critical challenges in 3D integrated circuits. Incorporating thermal optimizations during the circuit design stages requires a convenient automatic method of doing thermal characterization for feedback purposes. In this paper, we present a methodology, which supports thermal characterization by automatically extracting the steady-state thermal modeling resistance network...
Parallel and monolithic 3D-integration directions offer pathways to realize 3D integrated circuits but still lead to layer-by-layer implementations. This mindset causes challenging connectivity and alignment between layers when connected in 3D, with a routing access that can be even worse than 2D-CMOS, which fundamentally limits their potential. To fully exploit the opportunities in the third dimension,...
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