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This paper reports the demonstration of 2-5 µm embedded trench formation in dry film polymer dielectrics such as Ajinomoto build-up film (ABF) and Polyimide without using chemical mechanical polishing (CMP) process. The trenches in these dielectrics were formed by excimer laser ablation, followed by metallization of trenches by copper plating processes and overburden removal with surface planer tool...
This paper describes for the first time an innovative approach to improve re-distribution layer (RDL) yields in advanced semi-additive processes (SAP). An atmospheric pressure ozone based treatment is proposed as an alternative to oxygen plasma treatment. The ozone treatment process is scalable, being appropriate for process wafers up to large panels, and is suited for small feature sizes down to...
This paper discusses the effect of process induced variations in copper transmission lines on their electrical performance up to 110 GHz, fabricated by semi-additive processes (SAP) for redistribution layers (RDL). The motivation of this research is to quantify the effect of the process variations in RDL traces by SAP, thus enabling electrical designers to reduce design iterations to achieve precise...
This paper describes the improvement of advanced semi-additive processes (SAP) to demonstrate 1.5-5 µm lines and spaces with 4-5 µm diameter photo-vias for multiple re-distribution layers (RDL) at 20 µm bump pitch on glass interposers. High performance computing systems for networking and graphics are driving ultra-high bandwidth interconnections between logic and memory devices. This signal bandwidth...
This paper presents a novel, high density, and large panel compatible thin film redistribution layer (RDL) process, with 2 µm diameter microvias and 2 µm fine line and space Cu traces on a thin glass panel using a photo-lithographic embedded trench approach. Newly developed thin dry film photosensitive polymer dielectrics were used for the fabrication of photo-vias and photo-trenches by conventional...
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