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In this work, we have used nanoindentation methods to explore the creep behavior, and aging effects of SAC305 solder joints at several elevated testing temperatures from 25 to 125 oC. A special high temperature stage and test protocol was used within the nanoindentation system to carefully control the testing temperature, and make the measurements insensitive to thermal drift problems. Solder joints...
Solder joints in electronic assemblies are often subjected to cyclic (positive/negative) mechanical strains and stresses. Such exposures can occur in variable temperature application environments or during accelerated life thermal cycling tests used for qualification. Cyclic loading leads to damage accumulation, crack initiation, crack propagation, and eventually to fatigue failure. In this investigation,...
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