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Due to growing environmental concerns, lead-free solder materials are being widely used in electronic assemblies. The Anand viscoplastic constitutive model is frequently used to represent mechanical behavior of lead-free solder materials in finite element simulations. However, prior experimental results have demonstrated that properties of lead-free solder materials degrade over time when exposed...
Solder joints in electronic packages are frequently exposed to thermal cycling. Such exposures can occur in real life applications as well as in accelerated thermal cycling tests used for the fatigue behavior characterization. Due to the CTE mismatches of the assembly materials, cyclic temperature leads the solder joints to be subjected to cyclic (tensile/compressive) mechanical loading. On the other...
Solder joints in electronic assemblies are often subjected to cyclic (positive/negative) mechanical strains and stresses. Such exposures can occur in variable temperature application environments or during accelerated life thermal cycling tests used for qualification. Cyclic loading leads to damage accumulation, crack initiation, crack propagation, and eventually to fatigue failure. In this investigation,...
The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work on aging effects, we have demonstrated that the observed material behavior variations of Sn-Ag-Cu (SAC) lead free solders during room temperature aging (25°C) and elevated temperature...
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