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In this investigation, Scanning Electron Microscopy (SEM) and Scanning Probe Microscopy (SPM) have been utilized to examine aging induced microstructural changes occurring within lead free solders. Unlike many prior studies, fixed regions in the solder joint cross-sections were monitored throughout the aging process, rather than examining different samples and/or different regions after the various...
Isothermal aging of lead-free Sn-Ag-Cu (SAC) solder joints leads to growth of intermetallic (IMC) particles in the solder bulk as well as growth of intermetallic layers at the joint interfaces with copper bond pads. Fracturing near the interfacial IMC layers is often found to be the primary reason for failures caused by drop impacts. The IMCs in SAC joints are primarily AgsSn and Cu6Sn5 binary compounds...
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