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This paper reviews 2D and 3D photonic integrated circuits and their applications in computing, networking, and signal processing. Various novel fabrication techniques leading to realization of chip-scale microsystems, and future prospects will also be discussed.
Motivation for photonic integration can be summarized as reduction of cost, power consumption, size, packaging, and failures (FIT), and challenges in photonic integration are to achieve high yield. Heterogeneous photonic integration provides an opportunity for combining advantages from multiple photonic integration platforms. For instance heterogeneous integration of silicon, InP, and silica photonic...
This tutorial reviews state-of-the-art heterogeneous 2D/3D photonic integration technologies involving various novel fabrication techniques leading to realization of chip-scale microsystems with photonic-electronic-integrated-circuits. Future prospects and challenges in computing and networking applications will also be discussed.
We transmit over all 30 spatial and polarization modes of a 22.8-km multimode fiber. 15-mode photonic lanterns enabled low-loss coupling into and out of the fiber and a time-multiplexed coherent receiver facilitates measurement of all 30 signals.
We propose two fragmentation-aware routing, spectral, spatial mode, and modulation format assignment algorithms for 3D elastic optical networks in temporal, spectral and spatial domains. Performance evaluation results validate that the proposed schemes can greatly reduce blocking probability in 3D EONs.
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