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We present design, fabrication and characterization of a compact photonic integrated circuit consisting of tri-layer Si3N4 platform including path-length-matching waveguides, multi-layer vertical couplers, arrayed waveguide gratings as demultiplexers, multimode interferometers and heater based phase tuner for long-baseline interferometric imaging.
This paper reviews 2D and 3D photonic integrated circuits and their applications in computing, networking, and signal processing. Various novel fabrication techniques leading to realization of chip-scale microsystems, and future prospects will also be discussed.
Motivation for photonic integration can be summarized as reduction of cost, power consumption, size, packaging, and failures (FIT), and challenges in photonic integration are to achieve high yield. Heterogeneous photonic integration provides an opportunity for combining advantages from multiple photonic integration platforms. For instance heterogeneous integration of silicon, InP, and silica photonic...
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