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The necessity of the Metal-Insulator-Metal Capacitor (MIMCAP) devices that helps electrical performance of integrated circuit (IC) has drastically increased for high performance mobile SoC applications. We investigate the magnitude of intrinsic stress employed onto C4 package depends on the MIMCAP size embedded in Silicon die. It is also found that MIMCAP can mitigate 25% stresses imposed on ULK layer...
In this study, the effect of Ag content (1.8 & 2.3 wt.%) on the electromigration lifetimes and microstructure evolution of Sn-Ag solder bumps were investigated at highly accelerated electromigration test conditions. Electromigration of solder joint under high current stressing has been an important concern of the reliabilities in solder joint system, since the higher device density and increasing...
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