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Nowadays, package is more complex and it takes much time to design. In this paper, use the equivalent circuit model of package substrate which the laboratory have (Package-Intellectual-Property, hereinafter referred to as PKG-IP), Agilent ADS, and ANSYS HFSS to find the best design with different packages' circuit characteristics and the influence of electromagnetic. By using the PKG-IP, it can get...
In this paper, novel microwave double-side calibration and measurement technology is presented. The thru kit which is the key element in the SOLT (Short, Open, Load, Thru) calibration method will be modified into the novel double-side thru calibration kit. And through novel double-side calibration kit, that can accomplishment the GSSG to GSSG four port calibration. For this purpose, there are two...
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