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This paper proposes to use the high density of vias enabled by monolithic 3D integration to produce multi-stack FPGA designs with improved performance and functionality. The use of fine grain vertical interconnects enables reconfiguration of FPGA logic within a few clock cycles, as shown in our design that features dynamic reconfiguration capabilities through the use of a pair of configuration memories...
Phase transition materials (PTM) [1] have shown an immense promise for several applications such as realizing steep switching Phase-FETs [1], augmenting the read operation of memories [2-3], non-linear selectors for cross-point memory arrays [4] and in the design of neurons [5] and oscillators [6]. Their unique properties open up new avenues for other designs as well and therefore, there is a need...
The technology advancements in semiconductor process have led to rapid progress in design and fabrication of multiple-input Nano-electro-mechanical relays/switches (NEM relays/NEMS). This work explores the design space of implementing image processing algorithms using a hybrid multiple-input NEMS -- CMOS architecture. Different from the existing the approaches of building logic gates (e.g. INV, AND,...
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