Search results for: A. Tessmann
IEEE Journal of Solid-State Circuits > 2008 > 43 > 10 > 2194 - 2205
IEEE Microwave and Wireless Components Letters > 2008 > 18 > 8 > 557 - 559
IEEE Journal of Solid-State Circuits > 2008 > 43 > 10 > 2194 - 2205
IEEE Microwave and Wireless Components Letters > 2008 > 18 > 8 > 557 - 559