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A highly sensitive frequency-shift keying (FSK) receiver with low power consumption that is based on the injection-locking technique is proposed for short-range wireless (SRW) applications. The proposed FSK receiver comprising a sub-mW low-noise amplifier (LNA), a trifilar transformer splitter, and an injection-locked self-oscillating mixer (SOM) is fabricated using 90 nm CMOS technology. Measurement...
A comprehensive study based on chip-package co-modeling compares the effects between flip-chip ball-grid-array (FC-BGA) and wire-bond quad-flat-nonlead (WB-QFN) packages on a front-end cascode low-noise amplifier (LNA) in a 2.45 GHz CMOS wireless local area network (WLAN) receiver. In practical applications, the established package models are used to predict the degradation of figure of merit (FOM)...
A comprehensive study is presented to compare the effects between flip-chip and wire-bond packages on a front-end cascode low-noise amplifier (LNA) in a 2.4 GHz CMOS wireless local area network (WLAN) receiver. To construct the package electrical models, specific modeling dies are designed to help extract the equivalent-circuit elements from measured S-parameters for chip-package interconnects. Furthermore,...
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