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A chip-to-package wireless power transfer concept is applied to MMIC and antennas on LCP substrate is presented. Electromagnetic simulations show the feasibility of the proposed approach. As a benchmarking topology at the working frequency of 35.4 GHz, an Archimedean spiral antenna matched to a heterogeneous transformer, which couples the power received by the antenna to the chip, has been simulated...
A new contactless assembly method for SoC wireless transceivers and antennas on flexible and paper substrates is presented. An Archimedean spiral antenna, matched to a heterogeneous transformer which couples the received power to the chip wirelessly has been simulated at 1.5 GHz. Finally, a proof-of-concept prototype was fabricated and experimented. The measurements of the complete structure including...
This paper deals with a low-cost method for the assembly of flexible substrate antennas and UHF RF identification silicon (Si) chips. Such a method exploits a magnetic coupling mechanism, thus not requiring for galvanic contacts between the Si chip and antenna itself. The magnetic coupling is established by a planar transformer, the primary and secondary windings of which are implemented on flexible...
This paper examines the implications of decoupling the FDTD grids between and FDTD Electromagnetic (FDTD-EM) and an FDTD Hydrodynamic semiconductor simulator. Excitation methods and responses are examined to determine feasibility for decoupling the space and time grids for significant computational savings. Additionally, a new fully-explicit leap-frog discretization of the Hydrodynamic model is is...
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