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Nano-structuring using laser direct writing technology has shown a great potential for industrial applications. A novel application of water droplets to this technology is proposed in this paper. With a hydrophobic layer and a controlled substrate temperature, a layer of randomly distributed water droplets with a high contact angle is formed on the substrate. These liquid droplets can be used as lenses...
Technology challenges and solutions in the development and fabrication of high-density three dimensional (3D) chip integration structures have been investigated. Critical 3D integrated circuit (IC) enabling technologies, such as through silicon via (TSV), wiring and redistribution layer (RDL), wafer thinning and handling, micro-bump (μ-bump) processes and joining, that form the building blocks for...
The PBTI is an important issue in the high-k dielectric nMOSFET devices in the present CMOS technology. In this paper, Random telegraph noise (RTN) technique was employed to investigate the stressed-induced traps and their correlation to the hot carrier and PBTI effects. It was found that the positions of stress-induced traps (SITs) are mostly located in the high-k layer, but not close to the high-k/SiO...
This paper presents power loss analysis of grid-connection PV systems, based on the loss factors of double line-frequency voltage ripple, fast irradiance variation, fast dc load variation, non-uniform solar cell characteristic, and limited operating voltage range. These loss factors will result in power deviation from the maximum power points (MPP). In the power loss analysis, both single-stage and...
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