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The chip-level 10-Gbit/s optical interconnects with the BER better than 10−12 using the 1 × 2 polymer vertical splitter, which is composed of a polymer waveguide and three silicon 45° reflectors is demonstrated.
The chip-level 1 2 optical interconnects using the polymer vertical splitter developed on a silicon substrate are demonstrated. The 1 2 vertical-splitting configuration is realized using a polymer waveguide terminated at three silicon 45 reflectors. The high-frequency transmission lines combined with the indium solder bumps are developed to flip-chip assemble a vertical-cavity...
A polymer waveguide combined with three silicon 45° micro-reflectors is realized on a silicon substrate to form a 1 × 2 vertically optical splitter with a 20-Gbps transmission rate for on-chip optical interconnect application.
A polymer-waveguide-based optical circuit with two vertical-transition output ports for the optical interconnects is demonstrated on a silicon substrate. Such a 1 2 vertical splitter is realized using a polymer waveguide monolithically integrated with three silicon 45 microreflectors. The vertical-cavity surface-emitting laser chip assembled at the input port and two multimode fibers...
A polymer waveguide monolithically integrated with three Si-based 45° reflectors realized on a Si substrate is proposed to form a 1 × 2 vertically optical splitter. A VCSEL chip at the input port and two PD chips at two output ports are flip-chip assembled on the proposed splitter to demonstrate the chip-level optical interconnects. The optical insertion loss of −4 dB with a splitting ratio of 1:1...
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