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During SOI-based gyroscope fabrication, wet etching in hydrofluoric acid is utilized to etch buried oxide layer(BOX) and release micro-structures of the gyroscope. The BOX layer is beneath the micro-structures, and it's not easy to observe when the release process is finished, so a gradual release experiment is conducted to find the right etch time. Release experiment is carried out in two kinds of...
In this paper, experiments were carried out to fabricate a kind of free-standing silicon nitride thin film which was applied to many MEMS devices, especially for the gas flow sensors and Pirani. A series of manufacturing processes were researched and optimized to obtain perfect experimental results. LPCVD silicon nitride, dry etching silicon nitride and wet etching silicon were carefully studied in...
In this paper, experiments were carried out to confirm that Copper layer was a feasible masking material during the wet etching process of Pyrex glass for vacuum packaging or 3D packaging. Our study revealed that the sputtered Chromium and Copper layers combination with the electroplated Copper layer is an ideal etching mask. The improvement of the corrosion solution produced some more reliable results...
TSV fabrication consists of five major processes: via formation, via filling, wafer thinning, wafer handling, and die/wafer bonding [1–2]. Wafer thinning is one of key TSV processes which contributes more than 20% of TSV manufacturing cost and should be studied in a systematic manner. In wafer thinning process, especially for ultra-thin wafers, a reliable handling system is indispensable. The best...
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