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One important challenge in power electronics design is removing the heat cost effectively from the power devices mounted on thermal vias on a printed circuited board (PCB). Thermal vias is a cluster of small diameter hole plated with copper and is used to transfer the heat from one side of the PCB where the power device is soldered to the other side which is generally mounted on a heat sink using...
A daunting challenge in packaging design for power electronics products is removing the heat from the power devices in a cost effective manner. In this paper, a thorough literature review of the design and analysis of thermal vias in PCBs for thermal management of power electronics devices are presented. Based on the results from the available literature and practical manufacturing guidelines, four...
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